Advanced Solder Dispensing Process Evaluation for Miniaturization and 3D Assembly (IMPACT 2024)

The benefit of Miniaturization technology is obviously, providing product smaller XYZ size to accommodate larger volume battery to increase battery life of terminal product or integrating more functions (components) within original layout area. Not only be applied on SiP module but also PCBA, especially for mobile (phone/Laptop/Tablet…) and wearable devices (earphone/smart watch/smart glasses…). Solder dispensing process is widely applied on metal shield soldering in SiP module in USI. Advanced solder dispenser can dispense extremely small dot size which is smaller than 100um to provide the required solder paste for tiny components, for example passive 008004” and fine pitch (< 200 um) bump package. It is valuable especially on mixed component size(big and fine pitch) layout case. 3D assembly (cavity design) is another applied case, not only fabrication cost and lead time of 3D stencil is much higher (~2 times) than a normal one, but also lifecycle is also a concern. The purpose of this paper is to evaluate an advanced solder paste dispenser and alternative solder paste models to get engineering ready for miniaturization and 3D SMT assembly solution in the future.