Modeling Thermal Conditions of a Radio-Electronic System with a Dense Arrangement of Radio-Electronic Equipment to Predict its Failures

A thermal model of a radio-electronic system with a dense arrangement of electronic equipment has been developed. The model is based on a hierarchical decomposition of thermal processes according to the “device-block” principle. The resulting thermal model can be used to assess the thermal conditions of electronic power amplification units with forced air cooling, as well as to generate synthetic data when preparing models for predicting failures of an electronic system caused by equipment overheating. It is shown that the use of synthetic data of the thermal model allows, in the absence of real data, to obtain predicted values of controlled temperatures with the required accuracy.