Low-Profile Self-Packaged Multimode SIW Antenna With Low-Loss Air-Bridge Interconnection

This letter presents a design of a self-packaged multimode antenna at the W band. The modes of the aperture antenna are analyzed. An additive resonant mode is excited by introducing a radiation patch. A metal post is inserted in the resonance cavity to suppress an undesired mode. The multimode antenna is embedded in a silicon interposer with air bridge in wafer-level packaging. The insertion loss of the air bridge with coplanar waveguide with grounds (CPWGs) is measured. The proposed antenna is fabricated by using in-house silicon-based microelectromechanical systems (MEMS) photosensitive composite film fabrication process. The measured gain is 7 dBi at 92 GHz with an impedance bandwidth of 81.4 GHz to 109 GHz. The self-packaged antenna shows some advantages and can be further integrated with other components.