From 3D-IC to 3D-HI for Environmentally Durable Rugged Electronics (EnDuRE)

The pursuit of higher packing density has propelled the shift towards three-dimensional (3D) integrated circuits (3D-ICs), promising heightened performance, accelerated data speeds, and reduced power consumption. However, formidable challenges such as high temperatures, salinity, and radiation pose significant hurdles for 3D-ICs due to silicon's properties. This review delves into the impact of these conditions on 3D-ICs, emphasizing the quest for durable materials capable of withstanding extreme environments. It illuminates key 3D-IC technologies, thermal management strategies, and advanced packaging methods aimed at ensuring reliability in demanding settings. Advanced 3D-ICs based on 3D heterogeneous integration (3D-HI) are positioned to transcend the limitations of traditional planar integrated circuits, facilitating stable performance for extreme large-scale heterogeneous integration.