Reconfigured Wafer-on-Wafer 3D Integration with Meta Bonding Technologies

With the end of Moore's scaling, advanced microelectronic packaging is a critical part of semiconductor manufacture, not only to protect them from the heat generated by ever-increasing power but also as a way to actually improve system performance. The backbone of the packaging is chiplet design and heterogeneous integration, including advanced bonding technologies, which we call “Meta Bonding®”, to efficiently re-interconnect the various components with fine-pitch redistribution layers (RDLs) on interposers. In this paper, we introduce reconfigured wafer-on-wafer (RWoW) 3D integration to meet chiplet integration using recent advancements of “Meta Bonding®” technology, such as fine-pitch solder microbump bonding and chip-on-wafer Cu-Cu hybrid bonding.