Simulation of RF de-sense in small form factor stacked die packages

This paper describes the simulation flow for estimating the RF receiver SNR and desensitization (desense) due to electromagnetic interference (EMI) in small form factor packages with RF transceivers and digital interfaces. Signals from digital clocks, with fast edge rates, that propagate through bondwires, and package structures placed near the RF macro couple magnetically (mainly) onto the RF transceiver on-die coils and package structures and can cause desense of the RF receiver.