Additive Fan-Out Panel-Level Processing of MOSFET Devices

We present CSAP (Competitive and Sustainable Advanced Packaging), a packaging technology that combines aspects of advanced packaging and printed electronics. CSAP distinguishes itself by replacing conventional compression molding with laser drilled vias and semi-additive plating by cost effective, fully additive printing processes. The cost benefits that printed electronics can bring with respect to traditional Fan-Out Panel Level Packaging (FO-PLP) are quantified using a costs model. We found that CSAP can potentially bring a significant reduction in the packaging cost with respect to standard FO-PLP as well as a significant reduction in capital expenditure required to setup manufacturing capabilities. The cost reduction for the CSAP originates mainly from the via's forming process through screen printing, a parallel process, replacing the serial laser drilling process. The feasibility of the technology is verified with a proof of concept DFN silicon MOSFET package device.