Dual-Stripline Configuration for High-Density Routing in Chiplet Interconnects

Routing density is becoming in big challenge in die-to-die interconnects. In this article, we propose use of the dual-stripline configuration for routing signals in high-density interconnects. The scheme can improve the routing density by up to 33% when compared with the conventionally used stripline configuration. To address the challenges of crosstalk due to the proximity between vertically adjacent signal lines, half-pitch offset between lines on vertically adjacent layers has been proposed. The proposed routing scheme has been validated using 3-D full-wave electromagnetic simulations. The simulations show that the scheme can be used for increasing the routing density in the bunch-of-wires interface by 25%, while meeting all the bunch-of-wires channel specifications, which include eye-opening value above 68% unit interval at a bit error rate of $10^{-15}$, with data rates of 16 Gbps per wire.