Structural Design and Thermal Analysis of A Sealed Chassis for An Array

According to the requirements of the internal chassis structure and heat dissipation of a array, an embeddedcontype, pluggable and modular sealed chassis was proposed, and its overall structure design was carried out. The composition, function, maintainabilitydesign, andelectromagnetic shield design of the chassis were described in detail. Under the cooling requirements of the array, forced liquid cooling has been used to achieve the heat dissipation of the chassis. The flow channel of the chassis was designed, and its pressure resistance was analyzed. The result shows that the maximum stress of the flow channel is 14.18 MPa, which is far less than the ultimate yield strength of the material. The model was simplified and the boundary conditions were set for thermal simulation. The results show that the maximum temperature of the plug-in shell is $54.5^{\circ} \mathrm{C}$, and the flow resistance is 0.204 MPa and 0.214 MPa, which meets the requirements of thermal design. Finally, the chassis was loaded into the array and passed the environment test ofshock, vibration and humidityand electromagnetic compatibility test. It can indicate that the design and analysis of the chassis is reasonable and effective, which can meet the requirements of equipment use.