Identification of Recovering Package Leakage Failure Mode Via Novel Comprehensive Failure Analysis Technique

The packaging of semiconductors significantly impacts their performance, especially with the current emphasis on energy-saving applications. Increasing package complexity has led to issues such as leakage. Therefore, failure analysis (FA) is crucial in identifying the actual root cause of these failures. Device recovery issues have been rising, correlating directly with advancements in new process technologies and packaging methods. This paper introduces a novel FA methodology that combines electrical characteristic analysis, precise package fault isolation, mechanical cross-sectioning, and Focused Ion Beam (FIB) techniques. This integrated approach helps resolve failure recovery issues and efficiently identify the root causes of failure mechanisms. Without proper FA procedures for recoverable package leakages, critical evidence might be missed, leading to inaccurate FA results or conclusions and a high chance of recurring failures. The proposed methodology begins with electrical characterization to identify anomalies, followed by precise fault isolation to pinpoint the fault. Mechanical cross-sectioning or FIB allows for a detailed examination of the package layers. By integrating these techniques, our methodology provides a comprehensive view of the failure mechanism, ensuring no potential cause is overlooked. In summary, this work presents a comprehensive FA methodology that enhances the identification of device failure mechanisms. As a result, package recovery issues are addressed effectively, providing the production team with precise insights into the failure mechanisms and facilitating accurate investigations. This methodology resolves immediate recovery issues and contributes to long-term improvements in semiconductor packaging and performance.