The Applications of Simulation and Artificial Intelligence in Advanced Packaging

Advanced Packaging enables the heterogenous integration of chiplets with die embedding and die stacking techniques, and provides maximum device performance with much faster product development cycle. However, as the 2.5D and 3D packages are getting more and more complicated, it is very challenging to ramp the yield and assure the reliability of new products within the short timeline, using conventional methods. Artificial Intelligence (AI) assisted design co-optimization, manufactory process simulation and monitoring, yield enhancement, reliability assurance, and failure mode prediction, which are developed for Si fabrication, could be employed to shorten the advanced packaging development cycle. This paper summarizes the current status for the various applications of simulation and AI in advanced packaging. Further development trends are highlighted with the goal of providing a holistic and robust virtual representation, or digital twin, for advanced packaging.