Enhanced Packaging for Reliability Improvement of P1.2 Mini-LED Emissive Displays in High Temperature and Humidity

As the next-generation display technology, the mini-LED (MLED) emissive display adopts a current type thin-film transistor (TFT) device to drive light emission, possessing advantages, such as high contrast ratio and high brightness. Among them, package on glass (POG) is to bond the encapsulated MLED to the TFT glass substrates. Compared to printed circuit board (PCB) substrate, the usage of rigid glass substrates allows for smaller linewidth and line space to meet the needs of high pixel per inch (PPI) products while maintaining product lightness and thinness. In this study, we used parylene C and barrier film packaging to explore different processing routes. By comparing different packaging methods, it was demonstrated that the P1.2 (lamp bead spacing 1.2 mm) MLED product could pass the 500-h reliability test at 60 °C and 90% relative humidity (RH) using parylene. This advanced packaging solution is of great significance for improving the reliability and panel lifetime of MLED emissive displays.