A frugal integrated circuit packaging for non-planar surface-conformant electronics applications

This work presents a proposal for semiconductor packaging for application in flexible electronics, with simplified manufacturing, aiming to create a low-cost alternative to meet the global demand for semiconductors. It consists of two layers: a base substrate and an interconnection substrate, which can be manufactured from FR-4 laminates, polyimide, polyamide, PET, PEN, and LCP. A proof of concept was fabricated to demonstrate its feasibility. After packaging assembly, a test silicon die was positioned in the center, and connections were made using gold wire bonding. The correct electrical connection between the die pads and the packaging electrodes was verified by measuring electrical continuity in daisy-chain structures.