Switching Filter Bank Module Based on Advanced RF System-in-Package

This paper presents a switched filter bank module that is based on High-Temperature Co-fired Ceramic (HTCC) technology. By employing System-in-Package (SiP) technology, this module integrates multiple Monolithic Microwave Integrated Circuits (MMIC) within a three-dimensional structure. The module effectively satisfies the requirements of RF front-end systems in digital array antenna systems, thereby significantly enhancing the performance of modern communication systems. Boasting dimensions of 11.00 mm × 11.00 mm × 3.65 mm, the switched filter bank module features a compact design that facilitates integration into a wide range of RF applications. Test results demonstrate that the module covers a passband frequency range of 1-6 GHz, showcasing exceptional frequency response characteristics.