Research and Application of Non-Hermetic Key Technologies in Aerospace RF Components

In order to meet the non-sealing requirements of 30GHz band radio-frequency(RF) components in space-borne phased array antennas, the non-hermetic protection of silicon chips and gold/aluminum bonding circuits in ceramic cavities is proposed by using epoxy encapsulant and conductive adhesive capping method. Combined with the reliability assessment tests of reflow soldering, temperature cycling, and accelerated steady-state damp heat, the encapsulation method is studied and clarified, and when the thickness of the adhesive layer is 0.20mm, the semi-encapsulation method has less influence on the strength of the bonding wire, microwave gain and impedance, and had excellent circuit moisture protection. Through the temperature acceleration model, it is calculated and analyzed that the technology can support the service life of the whole system for more than 5 years and meet the design requirements, and the results show that the non-hermetic technology has the feasibility and potential value of low-cost, high-reliability application in aerospace RF components.