Design Optimization and Performance Evaluation of Direct Liquid Single-Phase Jet Impingement Heat Sink for High-Performance Computing Chips

This study introduces a prototype of direct liquid jet impingement heat sink for flip-chip (FC) packaged high-performance computing chips. The direct jet impingement heat sink was fabricated using 3D printing technology, with its structure and geometric parameters optimized. Experiments were conducted to determine the cooling capacity of the heat sink under various heat fluxes, where thermal test vehicle (TTV) chips were employed to emulate the heat generation of high-performance computing chips. Experimental results reveal a cooling capacity of 1000W, with a maximum temperature rise of about l06.63°C compared to the inflow. Under uniform heat flux conditions, the experimental and numerical results are in strong agreement, with a maximum deviation of only 1.77°C. However, under conditions of hot spot heat flux and background heat flux, larger deviations emerge between experimental and numerical results, primarily due to the absence of coolant boiling in the numerical model. In future studies, optimization of heat sink structure and investigation of 3D printing materials will be conducted to enhance cooling efficiency and durability, while more precise and volume manufacturing techniques are supposed to be used to advance the proposed direct liquid jet impingement heat sink technology.