Research on Bump Preparation Technology Based on Fully Automated Ball Bonding Process

This article analyzes the method of bump preparation on chip pads using the fully automatic wire bonding ball-planting process. Through orthogonal analysis, it discusses the effects of bonding pressure, bonding time, and ultrasonic power on the interface bonding strength of gold bumps, thereby obtaining the optimal process parameters for chip pad bump preparation. The experimental results show that the shear strength of the gold bumps on the chip pads is greater than or equal to 0.76mg/um², the offset of the bumps is less than one-quarter of the gold bump diameter of the bump. This research has successfully simplified the complexity and high coast of the traditional bump preparation process, providing an effective technical solution for the chip packaging industry.