Quality Compliance of HDI PCBs for Space Use

Increasing micro-miniaturisation is driving decrease in volume of electronic packages, putting stringent demand on use of cutting-edge ultra-high density I/O devices in smaller real estate on PCBs. This has put emphasis on PCB technologies like HDI that uses micro-vias as interconnects. It employs sequential build, unlike conventional MLBs, with blind & buried micro-vias on the outer-most layers along with buried vias in inner-layers. This in-turn provides increased circuit density in the PCB and are compatible with the latest high-density IC packaging technologies. This paper covers critical quality evaluation methodology to assess the space worthiness of HDI technology and its outcomes.