3D-Conformable Conductive Composite Film for Printed Circuit Board Level Electromagnetic Interference Shielding

With the progressive demands of electronics, advanced electromagnetic interference (EMI) shielding technology are desired to protect electronics against risk from EMI radiation under various conditions. In this work, a new kind of three-dimensional (3D) conformal EMI shielding technology based on a polymer composite film with high stretchability and electrical conductivity was proposed. The conductive composite film contains thermal plastic polymer matrix, metallic fillers and additives, which exhibits excellent conductive, stretchable and adhesive properties, and provides 3D conformable capability on a printed circuit board assembly (PCBA). The conductive composite film shows a high EMI shielding effectiveness value of 72 dB in the 30-3000 MHz and 91 dB in the 8.2-12.4 GHz at thickness of 65 μm, and relative near-field shielding effectiveness value of exceed 35 dB in 500-6000 MHz. Obviously, this novel conformal EMI shielding technology will be a promising candidate for application in board level shielding (BLS).