Application-specific investigation of inorganic potting material in drive trains

The performance of electrical components is limited by their thermal behaviour. This paper focusses on the thermal behaviour of three different subassemblies with an inorganic potting, namely the DC link capacitor, the peripheral electronics and the windings of an electrical machine. It is shown in which applications the greatest performance advantages can be achieved by potting with the inorganic material. The thermal connection of the DC link capacitors cannot be improved compared to the current state of the art. However, there is great potential in the encapsulation of the peripheral electronics, as both the heat dissipation and the strength of the solder connections are improved. The direct connection of the winding head to the cooling jacket shows a considerable advantage for the motor windings. The current density can be significantly increased due to the improved heat dissipation and high temperature resistance of the cement.