Package - System Thermal Modeling and New Material

A holistic Die-Package-System level thermal modeling methodology incorporating local details, global features and new material adoption are undoubtedly a key enabler to unleash the innovations of future advanced packaging technology development. Three key aspects were addressed to demonstrate such capabilities to guide the future 3D Fabric technology roadmap in HPC/AI industry applications such as instance level thermal modeling technique, Lid/Ring package type evaluation and advanced material/process impact to the die-package-system thermal performance. Firstly, an innovative System-to-Device modeling pointed out the nano-scale hotspot heating is highly sensitive to device junction temperature rise with the presence of BEoL (back-end) in 3DIC stacking schemes. Secondly, Lid package with TIM1 thermal resistance ≤5 C.mm²/W was identified as a potential solution for next generation large 3DIC package in high power HPC application. In summary, new material with process-friendly & better thermal conductivity from die level FEoL (front-end) & BEoL dielectric material, package level TIM1 and lid as well as system level TIM1.5 and TIM2 are key knobs to boost overall Die-Package-System thermal performance.