Thermal Resistance Modeling to Analyze and Simulate of Quad Flat No-Leads Packaging on Printed Circuit Board by Using ANSYS

With the rapid development of modern electrical and electronic technology, there is a growing challenge for traditional quad flat no-leads (QFN) packaging to face the demands of high voltage and current in power systems. Despite its popularity for microelectronic devices due to high integration and excellent thermal performance, QFN packaging is susceptible to significant power loss and heat generation during operation, potentially leading to chip damage and device failure. Therefore, ensuring temperature stability within QFN packaging is crucial. This article presents a thermal resistance network model that analyzes the heat dissipation path from the QFN packaging to the surrounding environment. Utilizing the commercial simulation software ANSYS, this model serves as a valuable tool for evaluating the thermal performance of QFN packaging. The data obtained from the simulations demonstrate the effectiveness of accurately calculating the temperature distribution of QFN packaging. Ultimately, this analysis model can offer valuable insights for optimizing the layout design and material selection of QFN packaging.