Computing self and mutual capacitance and inductance using even and odd TDR measurements

TDR (time domain reflectometry) measurement techniques for IC package characterization have been reported extensively and standardized by JEDEC, (Publication #123, JC-15 Committee, 1995). In addition, several techniques utilizing differential TDR measurements have been reported in (D.A. Smolyansky, High Density Interconnect Magazine, 2001). In this paper, we present a novel technique for computing self and mutual inductance and capacitance. This technique is based on applying computational procedures as described in the JEDEC publication to even and odd mode TDR measurements of the device under test, such as connector or IC package.