Packaged Tunable Single Mode III-V Laser Hybrid Integrated on a Silicon Photonic Integrated Chip using Photonic Wire Bonding

Photonic wire bonding is a passive laser-PIC integration process applicable at the wafer scale that offers relaxed alignment and mode mismatch tolerance. We present the first demonstration of a complete laser-PIC package operating in a single mode, with integrated output fiber and thermal tuning of ~1nm.