Rapid Analysis of Organic Contaminants in Semiconductor Process Chemicals and on Wafer Surfaces

We have developed instrumentation to measure trace levels of organic contaminants in process chemicals and solvents used in semiconductor fabrication as well as organic contaminants in the residue that can be left behind on the surface of a semiconductor wafer. The instrument combines the high sensitivity detection of Electrospray Ionization (ESI) and accurate mass determination of Time of Flight Mass Spectrometer (TOF-MS) with advanced automation to enable the real time detection of trace organics. Detection limits in the low parts per trillion(ppt) can be achieved for detecting organic contaminants in process chemicals. For measuring organic contamination on wafer surfaces scanning technique like VPD analysis is used and detection limits of ~10
¹¹
molecules/cm
²
can be achieved. This accomplishment meets the critical challenges related to analysis of organic contaminants outlined in the 2023 IRDS roadmap.