Innovative Approaches for 3D Metrology and Defect Analysis on Advanced Packaging Structures

With the rapid growth of advanced packaging technology, the task of conducting metrology and defect analysis on new packaging structures becomes more complex and demanding. This paper will present innovative approaches for conducting three-dimensional (3D) metrology and defect analysis on a high bandwidth memory (HBM) structure using a wafer-level plasma focused ion beam (PFIB) and scanning electron microscope (SEM) DualBeam system.