Combining Batchspray and Ozone Reduces Chemical Consumption in Wafer Cleaning

Sustainability has become a goal for the global economy, society, technology, and manufacturing including semiconductor fabs. The use of ozone for cleaning applications perfectly supports sustainability programs within semiconductor manufacturing. High throughput, minimum media consumption, and repeatable performance are just a few benefits of batch spray cleaning technology that incorporates the sicOzone process. Additionally, spiking technology combined with ozone results in comparable cleanliness compared to traditional cleaning methods. We present results showing particle levels, cleaning efficiency, metal contamination, oxide loss and uniformity.