Heterogeneous Integration of Silicon and Printed Electronics

Summary

The development of printed electronics provides new possibilities for the cost‐effective manufacture of large‐area flexible devices. The inkjet printing of silver interconnections on flexible substrates is suitable for printed electronic systems. This chapter presents a heterogeneous integration platform enabled by inkjet printing technology. The integration process shows great potential for the implementation of heterogeneous systems. The heterogeneous system is in strong demand, to combine high‐performance silicon electronics, which is of low cost per function, and flexible printed electronics, which is of low cost per area. The bending test indicates that the heterogeneous integrated system can work reliably for several applications such as healthcare devices and intelligent packaging. In order to improve the reliability and protect the conductive circuits against the environment, a thin layer of dielectric material could be added on top of the printed electronics as insulation and protection.