A new method for realizing JFETs and super B's in a standard bipolar IC process

A new method for the realization of p-channel JFETs is presented. It is based on the removal of thin silicon layers by repeated anodic oxidation and etching, allowing the shallow-n (SN) diffusion to penetrate deeper into the shallow-p (SP) region. JFETs with a thin channel are thus obtained with a high yield and good reproducibility.