Chip Scale and Wafer Level Packaging of LEDs

Summary

Most of the light emitting diode (LED) packaging processes are adopted from conventional integrated circuit packaging. An LED wafer level packaging (WLP) can be divided into two parts: silicon submount fabrication and LED packaging at the wafer level. This chapter reviews two types of advanced LED wafer level packages which utilize the technologies. The first one is a multichip package with a small form factor, while the other one has a cavity for die mounting to achieve a thin package. Chip scale packaging is one advanced packaging method in electronic packaging. The overall LED WLP process can be divided into two parts: silicon submount fabrication and the packaging process at the wafer level. The chapter discusses three case studies on LED WLP. The first two cases are “Multichip LED WLP with through Silicon Slots” and “LED WLP with a Cavity”. The remaining case is related to the application of LED WLP panels.