Research on Thermal Resistance Simulation and Testing Technology of Ceramic Packaging Package

With the continuous development of semiconductor devices towards miniaturization and high integration, the increasing thermal power consumption leading to high junction temperature and reduced related reliability performance has gradually become a barrier to their application. It is crucial to conduct thermal design based on external heat dissipation conditions and device package thermal resistance to ensure that the operating junction temperature of the device is within a certain range. This article takes commonly used ceramic package as the research object, introduces their typical package structures and heat transfer mechanisms, and uses professional thermal simulation software to simulate and analyze the heat dissipation effects of different structures. At the same time, thermal testing standard chips of the same size are used to verify the simulation results through infrared scanning method. Analyzed the effects of different heat dissipation structures, heat dissipation through-holes, and different heat dissipation substrate materials on the junction to package thermal resistance. The research results indicate that for the same package form, the thermal resistance increases with the increase of the thickness of the ceramic cavity substrate; Adding heat dissipation through holes in the chip bonding area can significantly reduce its thermal resistance, and the thermal resistance decreases with the increase of the diameter of the hot through holes and the number of through holes. The thermal resistance increases with the increase of heat sink thickness and decreases with the increase of heat sink thermal conductivity. Therefore, the design optimization of the heat dissipation structure can be achieved by increasing the area of the heat dissipation channel, shortening the heat dissipation path, and expanding the number of heat dissipation channels, effectively improving the heat dissipation effect of the package. The research results of this article have certain reference significance for the thermal design of integrated circuit ceramic package.