Design Optimization for Dual Clip Flat Lead Package Assembly by Simulation

Copper clip package plays a critical role in meeting the increasing requirement for high power density and high frequency switching applications. The dual clips concept with two dies within small outline package comes in place to meet the high customer’s requirements for power automotive application. As one of the challenges in package assembly design, the effect of clip and die design on function and reliability can be considered during the initial phase of package concept feasibility study. This paper focus on these factor effect for robust clip package design at initial stage of new package development by simulation. Simulation models are set up by considering different factors, such as to access the design for manufacturability, max device ratings, product and reliability performance such as thermal resistance and die stress performance during temperature cycle test (TCT). Comprehensive thermal, electrical and mechanical analyses are performed based on simulation results to show effect of these factors for selection of die design, single die with dual bond pads or two separated individual dies. This paper demonstrates a good case of simulation driven clip and die design selection for new package development of dual clip in small outline of flat lead package in Nexperia. Key learning from this study can be used to formulate simulation database and design guidelines for future product enhancement, reduce the design-to-implementation cycle time, identify high risk before fabrication and troubleshooting during production.