A Ka Band Tile T/R Module based on Silicon Packaging

Silicon interposers have been applied in 2.5D packaging especially for millimeter wave application recently, which have the advantages of high precision, high integration and low cost with mass production over traditional ceramic or plastic packaging by multichip module technology. This article aims at to develop a tile T/R module in Ka band by using silicon advanced packaging technology to minimize the size of the package and reduce the weight. In this paper, a Ka band tile T/R module is designed based on TSV silicon interposer 2.5D packaging technology. The channel link and signal transmission model are optimized by simulation analysis. The T/R module is completed by silicon packaging technology. The RF chips are integrated on the silicon interposer, and hermetic sealing is achieved by wafer lever packaging with silicon cap wafer. The size of fabricated Ka band tile T/R module based on silicon packaging is 14mm (length)×13mm (width)×2.1mm (height) and its weight is 0.5g, which greatly reduce the size and weight. Finally, the performance of single channel tile T/R module is tested and the receive gain(⩾17dB) and transmitted power(⩾23dBm) are measured in the range of 33~37GHz.