Simulation and Performance Test of High Bandwidth PCB Based on Multichannel Vertical Interconnection High Frequency Connector

With the rapid development of semiconductor industry technology, modern communication system equipment is developing towards high bandwidth, high-speed, high-density integration, and other directions. With the increasing speed of optoelectronic integrated chips, the high-speed transmission capability of packaging and test substrates directly determines the performance of the entire device. In this paper, a multichannel high-frequency test board with a 3dB bandwidth of up to 60GHz has been developed for the performance testing of high-speed multi-channel optoelectronic integrated chips [1]. Based on multi-channel high-frequency connectors, using three-dimensional electromagnetic field modeling, simulation, and optimization methods, combined with the processing characteristics of high-frequency packaging substrates, impedance matching optimization analysis was conducted for multiple discontinuous structures included in the entire high-frequency link, and excellent simulation design results were obtained [2]. After testing, the full frequency band return loss of each channel of the link is less than - 14dB, and the insertion loss value of each channel in the DC-60GHz frequency range is less than - 1.6dB. The test results are almost consistent with the simulation results, which can meet the performance testing of multi-channel integrated chips.