Study on the Effect of Manual Splitting on Thermal Fatigue Reliability of PBGA Solder Joints

Manual panel splitting stress can inevitably harm the reliability of surface mount solder joints, but it is difficult to detect using conventional quality analysis methods. In this paper, the same temperature cycle test is carried out using the two kinds of PBGA board level interconnection solder joints with/without manual splitting, and the impact of manual board splitting on the thermal fatigue reliability of PBGA solder joints is quantitatively analyzed, which can provide quantitative reference for relevant engineering practices.