Modelling and process development of ceramic heat transfer layers for ignition of integrated reactive multilayer systems

The integration of new materials raises the demand for low temperature integration technologies, especially for bonding purposes. In addition to the formation of mechanically strong, hermetic bonds, these technologies also have the potential to create the electrical contact between at least two functionalities. In order to transfer the ignition energy from one free standing integrated reactive multilayer system (iRMS) to another, additional coupling structures have to be integrated. This paper presents an approach to transfer the heat of the reaction from the bond frame to the interconnect pads via ceramic heat transfer layers (HTL) for reactive bonding applications. Finite element analysis (FEA) were used to simulate the reactive multilayer stack. By using i-line stepper lithography combined with 6.5 micrometer thick resist a lift-off was performed for structuring the reactive iRMS layer stack.