eWLB Fan-out Package for E-band Multi-Inputs/Outputs Phased Array IC

This paper discusses a eWLB packaging solution for a multi-I/Os phased array IC at E-band (71-76GHz) in this IC these mmWave I/O pins are located at middle of the die. A quasi-coax and a pseudo-CPWG structures within eWLB package are modelled and optimized for signal transition and phase match signals routing from IC. A BGA transition is used for interfacing this eWLB package with PCB. Measured insertion loss of this eWLB package is less than 3dB. This includes IC transition, 4.5mm eWLB trace, BGA transition and 1mm PCB test trace.