Challenges of Scaling Down High-Power Performance Flip Chip Ball Grid Array (FCBGA) Package

As the demand for miniaturization and cost reduction in microelectronic products continues to rise, there is a growing need for semiconductor packages that can be downsized while still meeting customer requirements for high power and performance products. In particular, there may be customer-specific demands for a product that can be downscaled to lower I/O counts and defeatured to focus on the core functionalities of the final product, meeting the printed circuit board (PCB) requirement where space is constrained. This study addresses the challenges of scaling down a high-power performance FCBGA package to smaller body size package while using the same silicon. The packaging method took into consideration the cost as it is always a sensitive subject to any business dealing. The challenges involve mold flash that pose thermal and cosmetic concern, and warpage that may cause various issues in PCB assembly. Thermal and mechanical simulations are used to provide comprehensive understanding on the effect of mold flash on package thermal performance and the effect of package design on the warpage performance. The findings guided appropriate package material selection. Assembly process optimization is necessary to obtain a package that meets manufacturability, quality and reliability requirements. The results presented in this study highlight the importance of simulations and assembly process optimization to ensure robust package design.