Development of UV Curable Wafer Back Side Protection-Film - IR Shielding Type -

The market demand for high performance and miniaturization of electronic devices is increasing day by day. In order to meet these demands, semiconductor packages must evolve to be thinner and higher performance. However, these evolutions involve the problem of fragility of electronic devices.To solve these problems, we have developed and provided Back side Protection-Film (BPF). BPF is used to mitigate handling damage, chipping during dicing, and increased package strength. However, Conventional BPF requires thermosetting process (e.g., 130°C) to cure the resin.In this study, we developed IR shield type UV curable BPF. The developed UV curable BPF is a new item that can provide new processes that does not require thermosetting process. It is expected to provide a new production process such as reduction of production process and energy saving for semiconductor package manufacturing.