Capacitive-based Wire Bonding Defects Detection Method for Integrated Circuit Package in Strip Form with Hybrid Threshold Setting Algorithm

The quality assurance of the integrated circuit (IC) package is critical during the manufacturing process; thus, IC manufacturers have explored different solutions to ensure the manufacturing quality. In recent years, a new solution based on the capacitive coupling has been introduced to provide another suitable alternative to tackle the limitations from the traditional methods like ATE (automatic test equipment) testing and AXI (automated X-ray inspection). The feasibility of this new solution has been validated through the real manufacturing lines and improved with further development these years. Thus, the latest measurement results and progress of this new solution are reported and discussed in this paper.