Electrical and thermal layout design considerations for integrated power electronics modules

A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the electrical analysis, including the parasitic extraction done by the Maxwell Q3D Extractor. A parametric study was conducted to determine the common model EMI noise of several different layouts. The final design layout was achieved after tradeoff between electrical and thermal performance.