Design & Development of Improved Relay Driver Using PEM for Space Application

Article details the design, development and realization of an improved relay driver module using plastic encapsulation packaging technique meeting various aerospace-application related requirements. Novel way of implementation of transfer moulding has been used in packaging. Challenge of achieving fit-and-form replacement of existing ASIC-based relay driver with discrete device has been dealt with PEM. Improvement over the relay driver module currently being used in spacecrafts are also presented. Advantages over conventional packaging techniques are provided. Specifications of the module along with materials and processes used in the realisation of the proposed module are detailed. Basic requirements for components to be eligible for use in spacecraft electronics is explained. Preliminary tests carried out over the developed module are discussed. Results are presented giving confidence of the PEM for use in future spacecrafts electronic.