Study on harmonic response of wirebond in high power IGBT module under ultrasonic welding process

In this paper, the finite element method was used to assess the vibration response stress at the heel of the wirebond under ultrasonic welding process, it proved that the optimized clamping method has lower stress than the original clamping method under welding, also it shows that reducing the looping height and looping ratio of the wirebond shape would reduce stress, and the twist shape of wirebond has lower stress than the straight one, the stress decreased by 79% in simulation result with several optimizations described above. Finally, the conclusion was proved correct by verification, which has significant guidance to ultrasonic welding process and high power IGBT module packaging.