Low Profile 3-D Printed Transmitarray for Future 6G Wireless Communications

A preliminary investigation of the possibility to exploit three-dimensional (3D) printing technology for the fabrication of a transmitarray (TA) is addressed. More in detail, both dielectric and metallic unit cells are designed with the purpose of providing a non-uniform phase profile of the TA panel to collimate the main beam at broadside direction ($\theta$=0°).