Basics of Semiconductor

Various semiconductor packages and electronic devices are used in various electronic devices such as smartphones, mobile phones, tablets, iPads, and notebook PCs these days. The basic performance of semiconductor packages, which are often used in electronic devices, is the function of efficiently connecting large‐scale integrated (LSI) circuit chips and printed circuit boards and the function of protecting LSI chips under usage in various environmental conditions. These are directly linked to the functions of electronic devices and LSIs, and therefore optimization is required in the selection of various materials that form semiconductor packages and the selection of highly reliable manufacturing conditions. In general, sealing resins, elastomer, and underfill resins are materials having so‐called viscoelastic properties whose thermal and mechanical properties change greatly with time and temperature, unlike metals and ceramics.