A Data-Driven Thermal Digital Twin of a 3-Phase Inverter Using Hi-Fidelity Multi-Physics Modelling

The assessment of Power Electronics Converters (PECs) reliability is a crucial research area for the development of robust PECs. The key parameter for reliability assessment is the real-time junction temperature (T
j
) profile for semiconductor power switches of PECs. While complex high-fidelity simulation models with electro-thermal models can accurately predict T
j
during the offline design phase, their computational requirements make them impractical for real-time applications. This paper proposes a methodology to develop a real-time hardware deployable model for estimating the junction temperature of an Insulated Gate Bipolar Transistor (IGBT) power device. A data-driven reduced-order model (ROM) of an industrial inverter setup based on a high-fidelity multiphysics simulation model is presented in the article. This work also contributes to the realization of virtual sensors and digital twins for PECs.