A Collaboration from High Frequency Soft Magnetic Materials to Integrated Circuit Design for beyond 10MHz Switching Power Supply

This paper reviews interdisciplinary collaboration from soft magnetic material engineering to CMOS integrated circuit design level aiming for high power density and high efficiency switching power supplies beyond 10MHz. The overviews of the Fe-based metal composite materials showing high permeability with very low loss up to more than 100MHz and high saturation magnetic flux density are provided. The high processability of this material allows forming a magnetic composite sheet that is highly compatible with the conventional low-cost interposer packaging process. This is important to reduce manufacturing cost to realize package-integrated magnetic components. Furthermore, circuit techniques for beyond 10MHz operation are also briefly presented.