Electromagnetic Interference Shielding Solution For System-In-Package

In the era of 5th Generation Mobile Communication Technology, communication equipment needs to support multiple frequency bands and integrate hundreds of components. Electromagnetic interference (EMI) between devices has become challenging in seriously-tight space. Many SiP devices began to adopt conformal shielding, compartment shielding or wire cage to achieve the purpose of EMI shielding and miniaturization. However, for a good shielding solution, there are many factors to consider, such as shielding size, material, ground connection, and distance from device. Otherwise, there will be poor shielding and interference issues, even affecting the modular performance. This paper presented measurement and simulation methods for conformal and compartment shielding in SiP package. Regarding conformal shielding, which is applied in sub6G band, analyze the effects of grounding the shielding coating, the thickness of the molding, and the sputter material on shielding effectiveness (SE). In the case of compartment shielding, filling materials of shielding wall and vertical are analyzed at high frequencies. In future 6G and mm-Wave applications, SiPs will become complex to keep high performance with innovations.