Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation

A fused-silica stitch-chip technology for an embed-ded low noise amplifier (LNA) module is demonstrated for the first time. In this article, the package substrate and assembly are reported and RF/mm-wave characterization of the LNA module is performed. A <2.5 dB package loss is measured within the LNA bandwidth (24–40 GHz), translating to a <1.4 dB package interconnect loss. In addition, thermal simulations are implemented for the LNA module to investigate the thermal impact of critical package components when a high power-density chiplet is packaged. The stitch-chip technology features broadband low-loss interconnects and enables the scalability of chiplet-based integration; this represents a promising solution for future mm-wave multi-chiplet based modules.