Reliability and Thermal Analysis of ACEPACK SMIT Power Module

Power modules development is becoming more and more important for switching applications, to improve electric and reliability performances. This paper presents an experimental-numerical method to characterize the reliability behavior of ACEPACK(Trade Mark) SMIT package, a top side-cooled module designed with a half bridge topology, which employs high-voltage silicon MOSFETs. The experimental test involves power cycling to study the reliability and thermal behavior. Then, a finite-element based model is developed to simulate test conditions, to calculate temperature behavior inside the package.